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Micro-abrasive blasting has a wide variety of applications such as:

  • conformal coating removal,
  • conformal coating rework,
  • abrading,
  • cleaning,
  • texturing,
  • precision deburring,
  • Parylene removal,
  • Parylene rework,
  • drilling holes and cutting slots in glass or silicon wafers
  • and much more.

Our abrasive blast equipment is used in many inudustries including Semiconductor, Electronics, Machine Shop, Medical, Dental Labs, Aerospace, Microelectronics, Museums and Fossils as well as Arts and Crafts.    

PESL has specialized in the field of micro abrasion technology for decades.

We are involved in all aspects of micro abrasive processing. We are automaters, manufacturers and end users. We offer manual, automated and custom systems as well as Job Shop Services to accommodate a number of diverse applications.  Working together with our customers as both manufacturers and end users, we have developed a full product line that enhances micro abrasion technology in more than one industry. As a result, we are the recognized leader and innovator in micro abrasive processing.  

Conformal coating material is applied to electronic circuits to protect against dust, moisture, chemicals, temperature extremes and vibrations. Thsi protection extends the life of the circuits. In order to rework or repair parts of the circuits, the conformal coating must be removed.

  • The technique of micro-abrasive blasting has many advantages when used to remove conformal coating:
  • It`s environmentally clean. 
  • You can easily comply with regulation requirements; it is a very effective long-term solution. 
  • It is fast. 
  • It is very cost-effective. 
  • You have the ability to selectively remove the coating from a specific targeted area. 
  • Specialized abrasive material such as Carbo Blast TM doesn`t damage the surrounding components or board. 

How does it work?

  • In the micro-abrasive blasting process, a precise mixture of dry air or gas and a abrasive media is propelled through a tiny nozzle attached to a stylus, which is either handheld or mounted on an automated system.
  • The mixture is pointed to the precise area of conformal coating to be removed. A vacuum system continuosly removes the used materials and channels them through a filtration system for disposal.
  • The Ionized Work Chamber and Point Ionizer TM is used to control levels of electrostatic discharge (ESD), preventing a buildup of static electricity.
  • It also contains the spent abrasive material.
  • Crystal Mark has technology that has helped many companies with conformal coating removal. We have products and ideas that work for your use cases. We customize the solution to fit your specific application.

Call us today, and find out more about conformal coating removal technology.

The quality of wafers is extremely important for effective fabrication of electronic circuits.

The Micro abrasive blasting can help in two important ways:

1. Surface Finishing: The SWAM® Abrading System by Crystal Mark finishes the surfaces     consistently with required precision.

Advantages of micro abrasive blasting:

a. Removes oxides and junctions.     

b. Eliminate the backside damage for gettering, mesa diode processing as well as for backlapping.     

c. Reliable cleaning.        

This technology can also be used for surface finishing, surface texturing as well as surface     preparation for a variety of different applications.

2.  Wafer coring and contouring:

Crystal Mark`s SWAM® C-5100 replaces all grinding     operations with one numerical, computer controlled, micro abrasive nozzle positioning     system. The micro abrasive blasting re-sizes the wafers without creating excessive      heating. Also, there is minimal effect from shock to the wafer.

It is designed for Cutting and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other      III-V materials as well as for Epi Crown Removal. 

Advantages of our technology: 

a. Precise work with guaranteed flat and/or notch in equivalent positions, This helps in keeping the alignment of silicon grains.

b. Smooth edges that help in preserving the wafers. Sharp edges from other methods can cause wafers to crack.

c. No crowning of wafer edges that limits effectiveness of wafer lines.

d. Protection from electrostatic discharge preserves the circuits/components built in the silicon of the wafers.   

e. Achieve dimensional tolerances up to +/- .002".    

f.  Complete automation and control that simplifies the wafer assembly lines.