Hybrid/Semi-Conductor
PESL can supply a wide variety of machine for an infinite number of applications within the electronics industry.
These include:
- Plasma Systems, Manual Wire Bonders, Epoxy-Eutectic Die Bonders
- Thermosonic Flip-Chip Bonders, Laser Diode Bonders & Testers
- Ga As Scribe & Break, Bonding Wedges, Voidless Vacuum Soldering Systems
- Convection & Conduction Reflow Furnaces, Hybrid Screen Printers
- Gross & Fine Leak Testers, Process Furnaces and Component Form, Trim Tooling, Lead Repair Systems
- Pulsed & Steady state Heat Sealing and Reflow Systems
- Auto Dispensing, Induction Heating and Brazing Systems
- Micro Abrasive Equipment & Spares.
Our ultimate aim is to deliver effective communication with our customers, empowering them to make an informed & justified decision to accurately meet their individual needs.
We will source and deliver the very best product to our customer within the acknowledged delivery date.
We will install (if applicable) & support any product we sell to ensure problem free production. If there is an issue we guarantee a 24 hour on site response to 80% of service issues, the remainder can normally be solved by telephone.