ADHESION PROMOTION
Plasma activation of electronic connectors and sensors prior to potting and encapsulation ensures an excellent hermetic seal, reduces current leakage and provides stronger physical bonding to the device. Plasma activation raises surface energies and ensures good wettability, and more complete flow of resins onto almost all low energy polymer materials, including PTFE, silicone rubber and Kapton. Polymer surfaces are made bondable by the reactive chemistry present in the plasma. New chemical functional groups are formed with strong chemical bonds to the bulk of the plastic allowing both aqueous based solutions and adhesives to wet into every crevice of the material. This allows a tremendous improvement in bonding, sometimes up to 50 times the strength of the traditional bond.
CRITICAL CLEANING
Residual cleaning of organics at the molecular level on materials such as glass, metals, plastics, polymers or composites prior to bonding, potting, printing, marking, painting or labeling. Plasma de-smear and etch-back of PCB's allows for the smear left on via walls after drilling to be removed before metallization can occur. In the optical disc mastering industry plasma cleans optical disc stampers, improves replicate release properties, and is used to eliminate certain types of defects on the disk masters.
