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Crystal Mark Products

Machine Tool Work

Crystal Mark has a strong foundation of research and 30 years of experience when it comes to Micro-Abrasive Technology. 

What are your challenges when doing precision machine work?

  • Accurate drilling? Micro-abrasive blasting can be used on hard brittle substrates such as glass, silicon, or alumina.
  • Controlling electrostatic discharge (ESD): Crystal Mark has technology that effectively controls ESD. Many of our customers are using it in applications such as conformal coating removal, cleaning medical devices or component demarking.
  • Deburring with custom tooling requirements:  Crystal Mark has developed products that help deburr any surface with ease.
  • Quality surface finishing: We help our customers with texturing, bead blasting, deflashing or any other application where quality of the surface determines the effectiveness of products and applications.

Cystal Mark helps hundreds of companies meet these challenges, and we can help yours.

Micro-Abrasive Blasting

In the micro-abrasive blasting process, a precise mixture of dry air or gas and an appropriate abrasive powder is directed to the part at a controlled velocity.  

A vacuum system continuously removes the used materials. The Nozzle can be handheld or mounted on an automated system.  We train our customers how to use the system and in handling details such as selecting the right abrasive. Using the correct abrasive is important for the long life of your equipment and end products.

Crystal Mark offers R & D services for your specific requirements. Tailoring the solution to match your needs is our specialty. 

We have dedicated support staff to help you with process verification.

Get the precision and control you need for your applications. And this clean technology is environmentally friendly.

Do you have more questions about how micro-abrasive blasting can improve your machine shop?

Conformal coating material is applied to electronic circuits to protect against dust, moisture, chemicals, temperature extremes and vibrations. This protection extends the life of the circuits. In order to rework or repair parts of the circuits, the conformal coating must be removed.

The technique of micro-abrasive blasting has many advantages when used to remove conformal coating:

  • It's environmentally clean. 
  • You can easily comply with regulation requirements; it is a very effective long-term solution. 
  • It is fast. 
  • It is very cost-effective. 
  • You have the ability to selectively remove the coating from a specific targeted area. 
  • Specialized abrasive material such as Carbo Blast TM doesn't damage the surrounding components, or board 

How does it work?

  • In the micro-abrasive blasting process, a precise mixture of dry air or gas and a abrasive media is propelled through a tiny nozzle attached to a stylus, which is either handheld or mounted on an automated system.
  • The mixture is pointed to the precise area of conformal coating to be removed. A vacuum system continuosly removes the used materials and channels them through a filtration system for disposal.
  • The Ionized Work Chamber and Point Ionizer TM is used to control levels of electrostatic discharge (ESD), preventing a buildup of static electricity. It also contains the spent abrasive material.
  • Crystal Mark has technology that has helped many companies with conformal coating removal. We have products and ideas that work for your use cases. We customize the solution to fit your specific application.

Call us today, and find out more about conformal coating removal technology.

The quality of wafers is extremely important for effective fabrication of electronic circuits.
The Micro abrasive blasting can help in two important ways:

1. Surface Finishing: The SWAM® Abrading System by Crystal Mark finishes the surfaces consistently with required precision.

Advantages of micro abrasive blasting:

    a. Remove oxides and junctions.

    b. Eliminate the backside damage for gettering, mesa diode processing as well as for backlapping.

    c. Reliable cleaning.

This technology can also be used for surface finishing, surface texturing as well as surface preparation for a variety of different applications.

2.  Wafer coring and contouring: Crystal Mark's SWAM® C-5100 replaces all grinding      operations with one numerical, computer controlled, micro abrasive nozzle positioning system. The micro abrasive blasting re-sizes the wafers without creating excessive heating.

Also, there is minimal effect from shock to the wafer. It is designed for Cutting and Edge Rounding of silicon, silicon carbide, sapphire, Geranium, NaG, GaAs, and other III-V materials as well as for Epi Crown Removal.


Advantages of our technology:      

  • Precise work with guaranteed flat and/or notch in equivalent positions, This helps in keeping the alignment of silicon grains.
  • Smooth edges that help in preserving the wafers. Sharp edges from other methods can cause wafers to crack.
  • No crowning of wafer edges that limits effectiveness of wafer lines.
  • Protection from electrostatic discharge preserves the circuits/components built in the silicon of the wafers.
  • Achieve dimensional tolerances up to +/- .002".
  • Complete automation and control that simplifies the wafer assembly lines.

 Contact us today - a sales advisor will be happy to speak to you.