Solder

Asahi Lead Free Alloy

VIROMET SERIES

Singapore Asahi is proud to present our low temperature lead free solder materials - Viromet alloy [US Patent: 5,985,212; 6,176,947; 6,843,862 World Patent: WO 03/006200 A1].

This alloy is enhanced SnAgCu alloy with addition of Indium.

Viromet 347: Sn/Ag4.1/Cu0.5/In7.0 Melting Temperature: 202-207 C

Viromet 349: Sn/Ag4.1/Cu0.5/In4.0 Melting Temperature: 205-210 C

Viromet 302: Sn/Ag3.0/Cu0.5/In2.5 Melting Temperature: 210-212 C

Due to the higher reliability and lower operating temperature, Viromet series of alloys are recommended as Drop-in Replacement for conventional SnPb alloy and also as a solution for all lead free applications in consumer, medical, automotive, military, industrial, telecommunication etc. In comparison to SnPb and other lead free solders such as SAC, Viromet Pb-free solder exhibits the following characteristics:

- Cost Effectiveness
- Low working temperature of 245 C, hence less electricity consumption
- No or minimum alteration of existing machines or equipment required
- No change in components and PCB boards required
- Applicable under normal air conditioned enclosures without the need for N2 environment
- Ease of Implementation
- Drop-in replacement for SnPb alloy
- Low operating temperature
- Minimal or no change to existing SnPb process
- High Reliability
- Excellent physical and mechanical properties
- Superior wettability even at low working temperature
- Compatible with wide range of substrates: Sn, Ni/Au, Ag, OSP etc
- No lifting of solder joints is observed for plated-through-hole applications

Viromet Reliability

PDF Files:

Reliability Result 1
Reliability Result 2

PBFREE Solder & Chemical

SCS SERIES

SCS, an enhanced tin/copper lead free alloy, is highly recommended to directly replace existing SnCu0.7 or SAC solder in different soldering applications [US Patent: 7,472,817; WO 2006/045995 A1; Japanese Patent: 4,048,288]. This alloy not only exhibits the excellent ductility of SnCu0.7 solder, it possesses superior mechanical strength both in ambient and high temperature environments. SCS's fatigue resistance is now comparable to tin/lead solder and as such, SCS has addressed the fundamental concerns of tin/copper alloys. Its applications cover wave soldering, SMT, HASL, dipping processes, manual/auto soldering and solder joints touch up using solder wires. This cost effective alloy has been designed to meet the most stringent requirements of the electronics industries.

SCS7: Sn/Cu0.7/Si0.02 Melting Temperature = 227C
SCSI73: Sn/Cu0.7/Si0.02/In3.0 Melting Temperature = 219-221C

Why SCS...

- Solution for cost effectiveness and high reliability
- Solved the fundamental problem of SnCu0.7 alloy
- Good mechanical properties even with ageing
- Good thermal fatigue resistance
- Excellent solderability and compatible with various surface finishes
- Low solder pot leaching tendency
- Low copper dissolution rate
- Excellent plated-through-hole fill
- Low drossing

View in PDF:

SnPb Anode
SnPb Solder Bar
SnPb Solder Ingot, Pillet and Stick
SnPb Solder Paste
SnPb Solder Wire
SnPb Special Alloy