PESL - Production Equipment Sales Ltd

Abrasive Division

Technical Notes

Abrasive Division

Technical Notes

	Technical Notes

Asahi Soldering Applications

http://www.asahisolder.com/Publication/Chew_Pang_Impact%20of%20Drop%20In%20Lead%20Free%20Solder_4oct05z.pdf

	Reflow Soldering Applications
	Fluxless Au:Sn Eutectic Solder Attachment of Hybrid Ring Frames:
	A fluxless Au:Sn eutectic soldering process for ring frame attachment to thick film hybrid substrates was developed and implemented at Space Systems/Loral using a Sikama Falcon 5/C conductive furnace. The furnace's highly accurate parameter controls, minimal fixturing requirements and simplicity of operation allowed for rapid process optimization. The new process has resulted in a significantly more repeatable and consistent ring frame attachment process with improved package reliability and production yields.
	For the complete report on this process please contact PESL

	Plasma Applications
	Plasma Modes: Primary and Secondary Plasmas :
	There are two basic types of cold gas plasma: ‘primary' (or ‘direct') plasma and ‘secondary' (or ‘indirect') plasma. Secondary plasma is also commonly referred to as ‘downstream' or ‘remote' plasma. The strengths and limitations of each type are addressed below.

	Primary Plasma
	Primary plasma is one in which a radio-frequency, electromagnetic field is used to generate a glow discharge, usually between a set of electrodes. Samples or substrates to be treated by the plasma are placed directly in the electromagnetic field between the electrode plates...

	Secondary Plasma
	Secondary plasma is used for materials that may be sensitive to some or all of the components in the primary plasma. Cycle times are typically longer for secondary plasmas due to the reduced concentration and energy of the active species. ..
	For the complete report on this process please contact PESL

	Flip-Chip Applications
	Flip-Chip Applications
	Low Temperature Reflow of Solder Bump Flip Chips Reflowing of small flip chips at low temperatures can be achieved using the combination of Ultrasonic Energy and Stage Temperature.Chip Size 1.76mm L x 1.28mm W x .72mm thick with 21 solder bumps melting temperature 218 deg C.
	For the complete report on this process please contact PESL

	Induction Heating Applications
	Localized Induction Heating for such applications as:
	* Silver Alloy Soldering for Copper and Brass Pipe Connections * Soldering Inserts in tools for Mechanical and Wood Industry * Heat treating of Metals to modify the Structural Characteristics * Soldering of Heavy Cables * Electromechanical Components
	For the complete report on this process please contact PESL